Akrometrix加热翘曲测试仪-对流加热模块cre6

Akrometrix加热翘曲测试仪-对流加热模块cre6

cre6用于Akrometrix回流仿真的对流加热模块


cre6（对流回流仿真）模块的thermoiré AXP系统由Studio软件驱动的一个附加模块。

cre6模块地址的较大分辨率表面测量和优化的**部/底部的温度均匀性的有效回流模拟半导体行业的需求，同时利用对流加热。


的cre6模块增强Akrometrix的行业标准的阴影莫尔é测量技术提供了Z从2.5微米到亚微米分辨率的位移测量。的cre6模块是可扩展的thermoiréAXP平台*四插件模块。


cre6模块的设计：cre6
较准确地模拟半导体封装的生产回流焊条件
3°C /秒加热速率
样品温度均匀度+ / - 2°C
70毫米直径圆形视野
的cre6模块在以下设备提供：




cre6相关产品
CORES 平面度测量/平整度测试/加热翘曲测量 
core9012a/core9031a/core9032a/core9037a/core9038a/core9045a/core9046a/core9050b/core9055a/core9060a/core9070a/core9100a
Akrometrix平面度测量/平整度测试/加热翘曲测量
AXP-300x233/Convective-Module-Tower/CRE6 Module/CXP/DFP Module/DIC 2.0 Module/Digital Fringe Projection/Digital Image Correlation/Akrometrix Interface Analysis/Akrometrix Part Tracking/PS200S/PS600S/Real Time Analysis/Akrometrix Shadow Moiré/Akrometrix Studio Platform



CRE6 Module
Convective Heating Module for Reflow Emulation

The CRE6 (Convection Reflow Emulation) Module is an add-on module for the TherMoiré AXP  system powered by the Studio Software. The CRE6 Module addresses the semiconductor industry requirement for maximum resolution surface measurement and effective reflow emulation with optimized top/bottom temperature uniformity, while utilizing convection heating.

The CRE6 Module enhances Akrometrix’s industry-standard shadow moiré measurement technique and offers Z displacement measurement from 2.5 microns down to sub-micron resolution. The CRE6 Module is the fourth add-on module for the expandable TherMoiré AXP platform.

The CRE6 Module is designed to:CRE6

Most accurately emulate production reflow conditions for semiconductor packages
+ 3.0 °C/sec heating rate
Sample temperature uniformity +/- 2 °C
70 mm diameter circular field of view
The CRE6 Module is offered on the following equipment: