Akrometrix加热翘曲和平面度测量仪ps600s

Akrometrix加热翘曲和平面度测量仪ps600s

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Akrometrix加热翘曲和平面度测量仪ps600s概述
Akrometrix的thermoiréps600s是计量解决方案，利用阴影莫尔é测量技术结合自动相位步进表征离面位移为样本600毫米x 600毫米。随着时间的thermoir温度的分析能力，éps600s捕获完整的样本的历史行为的用户定义的热漂移中。阴影莫尔é技术和动态相结合的温度测量是**thermoiré平台的基础。动态分析是较有效的方法来分析由现实世界的过程和操作环境引起的机械行为。使用thermoiréps600s，工程师们将更好地了解材料的相互作用包，基板和完整的组件，允许对系统进行深入分析，提高其可靠性和运行性能。

Akrometrix加热翘曲和平面度测量仪ps600s是专为满足OEM的要求，PCB工厂和合同制造商需要大型板/组件特性。其600毫米x 600毫米的视野，是较大的ps600s温度计量工具可用于微电子工业。

Akrometrix的ps600s可用于实验室：
故障/缺陷分析
质量保证/质量控制
高容量测试出部分跟踪技术
通过/失败的决定与行业标准，简化了实时分析软件
通过接口分析软件的连接接口之间的形状匹配
材料与设计选择
有限元模型的验证

Akrometrix与cores加热平面度测量时的表现对比
		前处理	自动化程度  定制		 报告速度  报告形式
Akrometrix      需要	  低	   主要以定制形式	  一般	    较少
cores		不需要	  高	   一般不需要定制  自动化	    4D视频+PDF等


Akrometrix加热翘曲和平面度测量仪ps200s相关产品
CORES 平面度测量/平整度测试/加热翘曲测量 
core9012a/core9031a/core9032a/core9037a/core9038a/core9045a/core9046a/core9050b/core9055a/core9060a/core9070a/core9100a
Akrometrix平面度测量/平整度测试/加热翘曲测量
AXP-300x233/Convective-Module-Tower/CRE6 Module/CXP/DFP Module/DIC 2.0 Module/Digital Fringe Projection/Digital Image Correlation/Akrometrix Interface Analysis/Akrometrix Part Tracking/PS200S/PS600S/Real Time Analysis/Akrometrix Shadow Moiré/Akrometrix Studio Platform



Thermal Warpage Measurement Tool

The TherMoiré PS600S is a metrology solution that utilizes the shadow moiré measurement technique combined with automated phase-stepping to characterize out-of-plane displacement for samples up to 600 mm x 600 mm. With time-temperature profiling capability, the TherMoiré PS600S captures a complete history of a sample’s behavior during a user-defined thermal excursion.

The combination of the shadow moiré technique and dynamic temperature profiling is the foundation of the patented TherMoiré platform. Dynamic profiling is the most effective approach to analyze mechanical behavior induced by real-world processes and operating environments. Using the TherMoiré PS600S, engineers will gain a better understanding of the interactions of materials, packages, substrates and complete assemblies, allowing for a thorough analysis of the system, improving its reliability and operating performance.

The PS600S is designed to meet the requirements of OEMs, PCB fabs and contract manufacturers who need large board/assembly characterization. With its 600 mm x 600 mm field of view, the PS600S is the largest temperature-dependent metrology tool available for the microelectronics industry.

The PS600S can be used in the laboratory:

Failure/defect analysis
Quality assurance/quality control
High Volume Testing complimented by Part Tracking technology
Pass/Fail decisions versus industry standards, streamlined by Real Time Analysis software
Shape matching between attaching interfaces via Interface Analysis Software
Material and Design Choices

FEA Model Validation